Spectrum Crack Growth in Adhesively Bonded Structure
- 1 January 1978
- journal article
- Published by ASME International in Journal of Engineering Materials and Technology
- Vol. 100 (1) , 57-63
- https://doi.org/10.1115/1.3443451
Abstract
A method is presented by which crack growth of damage tolerance type flaws can be predicted in adhesively bonded structure subjected to spectrum loading. The method accounts for a laminate stress intensity correction factor, induced bending and axial load transfer between plies, as well as a crack growth analysis procedure to predict the crack growth retardation behavior under spectrum load. Analytical predictions are compared to several test results to show the applicability of the prediction method presented.Keywords
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