Abstract
The requirements for substrates useful in hybrid microelectronics are changing. Substrates of high thermal conductivity are becoming very desirable mainly due to the trend and demand for electronic components and parts to be more dense and fine. Important properties of several alternative substrates are described and anodized aluminium is introduced as a possible novel substrate for hybrid microelectronic circuits. Primary experimental results on the electrical and mechanical properties of routinely prepared anodic films are presented.

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