CVD process for copper interconnection

• 30 November 1997
• journal article
• Published by Elsevier in Microelectronic Engineering
• Vol. 37-38, 97-103
• https://doi.org/10.1016/s0167-9317(97)00098-1

Abstract

Keywords

• OMCVD
• COPPER INTERCONNECTIONS
• BARRIER MATERIALS FOR COPPER