Thin-film circuit technology: Part I — Thin-film R-C networks

Abstract
Miniaturization requirements have brought about the integral fabrication of many components. The thin-film approach permits the integration of numerous precision circuit elements and their interconnections. Part I of this three-part series deals mainly with the two deposition techniques of cathode sputtering and vacuum evaporation, and with their use in the fabrication of film resistors, capacitors, and R-C networks. Subsequent articles will discuss thin-film transistors and cryogenic thin films Part I — Thin-film R-C networks

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