An electrical method for the measurement of thermal expansion of thin films
- 1 December 1981
- journal article
- Published by IOP Publishing in Journal of Physics E: Scientific Instruments
- Vol. 14 (12) , 1378-1380
- https://doi.org/10.1088/0022-3735/14/12/007
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- The size effect and the temperature coefficient of resistance in thin filmsJournal of Physics D: Applied Physics, 1978
- Alternating current investigation of copper phthalocyanine films in the presence of blocking contactsPhysica Status Solidi (a), 1976
- The thermal expansion of copper at low temperaturesProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1964
- Measurement of thermal expansion at low temperaturesCryogenics, 1961
- A new method for measuring the thermal expansion of solids at low temperatures; the thermal expansion of copper and aluminium and the Grüneisen rulePhysica, 1954