Temperature-dependent ion mixing and diffusion during sputtering of thin films of CrSi2 on silicon
- 1 August 1983
- journal article
- letter
- Published by AIP Publishing in Applied Physics Letters
- Vol. 43 (3) , 247-249
- https://doi.org/10.1063/1.94314
Abstract
Measurements of sputtering yields and composition profiles have been carried out using backscattering spectrometry for samples of CrSi2 on Si irradiated with 200‐keV Xe ions. When the CrSi2 layer is thinner than the ion range, the sputtering yield ratio of Si to Cr increases from 3.5 for room‐temperature irradiation to 65 at 290 °C. For a thick sample, the corresponding increase is from 2.4 to 4.0. only. These changes are explained in terms of a rise in the Si surface concentration at 290 °C. The driving force for this process seems to be the establishment of stoichiometric CrSi2 compound. Transport of Si to the surface is by ion mixing in the thin sample and thermal diffusion through the thick layer.Keywords
This publication has 7 references indexed in Scilit:
- Ion Mixing of Ni and Pt Layers on SiPhysica Status Solidi (a), 1982
- Sputter-enhanced diffusion phenomena in Cu/Ni alloys at elevated temperaturesJournal of Applied Physics, 1982
- Differential sputtering and surface segregation: The role of enhanced diffusionJournal of Vacuum Science and Technology, 1981
- Ion-beam-induced reactions in metal-semiconductor and metal-metal thin film structuresNuclear Instruments and Methods, 1981
- Ion-induced silicide formation in niobium thin filmsRadiation Effects, 1979
- Effects of enhanced diffusion on preferred sputtering of homogeneous alloy surfacesSurface Science, 1978
- Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline TargetsPhysical Review B, 1969