Packaging of large-scale planar lightwave circuits
- 1 May 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (2) , 121-129
- https://doi.org/10.1109/96.673698
Abstract
This paper describes the packaging of large-scale silica-based planar lightwave circuits (PLC's), fabricated on Si substrates. They include arrayed-waveguide grating (AWG) multiplexers and star couplers with more than 32 channels, and optical matrix switches with a scale of 8/spl times/8 or greater. These devices all have a large channel-number or a large number of switch elements. There are various technological objectives and techniques related to large-scale PLC's which concern their optical, electrical, thermal, and mechanical characteristics. Several techniques are presented in detail based on experimental results.Keywords
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