Changes of characteristics in ain ceramics surface by laser irradiation

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Abstract
When a highly thermally conductive A1N ceramic is used as an electronic substrate, the fabrication processes, such as dicing, resistor trimming, etc., are essential. However, when an A1N ceramic is irradiated by a laser beam during the scribing and resistor‐trimming processes, the resistivity of the ceramic decreases or its values become nonuniform.After analyzing the laser‐irradiated area of the ceramic by X‐ray photospectroscopy and thin‐film X‐ray diffraction, a very small amount of metallic aluminum was detected in the irradiated area.To avoid this problem: (1) laser irradiation should be carried out under 02 atmosphere so that the precipitated aluminum becomes α‐Al2O3; or (2) the ceramic should be treated thermally after irradiation so that the precipitated aluminum becomes α‐Al2O3. Therefore, when thermal treatment cannot be carried out after irradiation in cases such as resistor functional trimming and dicing thin‐film metallized substrates, method (1) should be used. When post heat‐treatment can be adopted (for example, thick‐film metallization process after dicing), method (2) should be used.

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