Intergranular fracture in copper under high temperature creep, fatigue and creep-fatigue conditions
- 1 September 1990
- journal article
- Published by Elsevier in Scripta Metallurgica et Materialia
- Vol. 24 (9) , 1795-1800
- https://doi.org/10.1016/0956-716x(90)90548-u
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- On the formation of magistral crack in high temperature creep of copperScripta Metallurgica, 1983
- Cavity growth and creep in copper at low stressesActa Metallurgica, 1982
- Percolation theory and its ramificationsContemporary Physics, 1980
- Percolation theoryReports on Progress in Physics, 1980
- A comparison of the dimple spacing on intergranular creep fracture surfaces with the slip band spacing for copperScripta Metallurgica, 1980