Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor Devices

This publication has 3 references indexed in Scilit:

• The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
• Deformation of AL Metallization in Plastic Encapsulated Semiconductor Devices Caused by Thermal Shock
  8th Reliability Physics Symposium, 1980
• Mechanical stresses likely to be encountered in the manufacture and use of plastically encapsulated devices
  Microelectronics Reliability, 1977