Comparative investigation of plating conditions on self-annealing of electrochemically deposited copper films
- 20 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 287-289
- https://doi.org/10.1109/iitc.1999.787146
Abstract
This paper discusses the effects of chemistries and plating conditions on the self-annealing or recrystallization of electrochemically deposited copper films. Current density, plating temperature and the concentrations of the organic additives were found to strongly affect self-annealing of the copper films. The results show that copper films deposited at higher current densities, higher concentrations of organic additives or at lower plating temperatures take less time to complete self-annealing at room temperature.Keywords
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