Integrated plasma-promoted chemical vapor deposition route to aluminum interconnect and plug technologies for emerging computer chip metallization
- 1 September 1997
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 15 (5) , 1758-1766
- https://doi.org/10.1116/1.589521
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Thermal desorption measurement techniqueJournal of Vacuum Science & Technology A, 1991
- Chemical vapor deposition of aluminum from trimethylamine-alaneJournal of Vacuum Science & Technology A, 1989
- Trimethylamine complexes of alane as precursors for the low-pressure chemical vapor deposition of aluminumChemistry of Materials, 1989