Cell structures in polycrystalline copper undergoing cyclic creep at room temperature
- 30 June 1985
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 33 (6) , 1121-1127
- https://doi.org/10.1016/0001-6160(85)90206-8
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
- Dislocation wall and cell structures and long-range internal stresses in deformed metal crystalsActa Metallurgica, 1983
- On modelling steady state and transient deformation at elevated temperatureScripta Metallurgica, 1982
- Fatigue hardening and nucleation of persistent slip bands in copperActa Metallurgica, 1982
- The bauschinger effect in copperActa Metallurgica, 1981
- Change of activation area during cyclic deformation. II. Quantitative interpretation with a model of heterogeneous plastie deformationPhysica Status Solidi (a), 1981
- Fatigue of copper polycrystals at low plastic strain amplitudesActa Metallurgica, 1980
- Dislocation structure in the interior of a fatigued copper polycrystalActa Metallurgica, 1980
- Change of long-range stresses in cyclic deformationPhysica Status Solidi (a), 1980
- A mathematical model of cyclic creep accelerationMaterials Science and Engineering, 1975
- Cyclic stress-strain response of F.C.C. metals and alloys—II Dislocation structures and mechanismsActa Metallurgica, 1967