Substrate bonding techniques for CMOS processed wafers
- 1 September 1997
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 7 (3) , 108-110
- https://doi.org/10.1088/0960-1317/7/3/006
Abstract
Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate and subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer.Keywords
This publication has 1 reference indexed in Scilit:
- Field Assisted Glass-Metal SealingJournal of Applied Physics, 1969