Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

Publisher Website

1 March 1995

journal article
Published by Emerald Publishing in Circuit World

Vol. 21 (3) , 20-24
https://doi.org/10.1108/eb044033

Abstract

Design and Procurement of Eutectic Sn/Pb Solder-bumped Flip Chip Test Die and Organic Substrates

Keywords

This publication has 1 reference indexed in Scilit:

Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards
Circuit World, 1993