Internal stresses and interdiffusion of Ti-Pd-Au films studied by X-ray diffraction techniques
- 1 May 1972
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 10 (2) , 273-282
- https://doi.org/10.1016/0040-6090(72)90194-0
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Termination materials for thin film resistorsProceedings of the IEEE, 1971
- Conductor Film Metallizations for Use in Tantalum Film Integrated Circuits8th Reliability Physics Symposium, 1971
- Solid Solution Effects in Thin Aluminum FilmsJournal of Vacuum Science and Technology, 1970
- X-Ray Diffraction Technique for the Investigation of Small Diffusion ZonesJournal of Applied Physics, 1970
- Dislocation Arrangements Resulting from the Diffusion of Zn into Cu: Etch-Pit StudiesJournal of Applied Physics, 1968
- Orientation of Crystallites in Evaporated Film of CdSJapanese Journal of Applied Physics, 1965