Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

• 1 January 1991
• book chapter
• Published by Springer Nature
• p. 384-405
• https://doi.org/10.1007/978-1-4615-3910-0_13

Abstract

Keywords

• PACKAGING
• MOUNT
• SMT
• PLANES
• SOLDER
• BROUGHT
• CIRCUIT
• SIDES
• JOINTS
• FATIGUE