Optical interconnects at the chip and board level: challenges and solutions
- 1 June 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 88 (6) , 806-818
- https://doi.org/10.1109/5.867694
Abstract
This paper discusses short-distance optical interconnects for general-purpose distributed digital systems. We describe the technology required to optically interconnect elements that are distributed across multiple packaging layers. This includes chips on a board, boards in a backplane, and shelves within a bay. The focus of this paper will be on technology capable of supporting high-data-rate, two-dimensional, optical communication using two-dimensional parallel optical interconnects.Keywords
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