Fabrication of submicrometer gold lines using optical lithography and high-growth-rate electroplating

1 July 1983

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters

Vol. 4 (7) , 210-212
https://doi.org/10.1109/EDL.1983.25708

Abstract

This letter presents a process for fabricating submicrometer gold lines with high aspect ratio and vertical sidewalls using high-growth-rate (133-nm/min) electroplating. A two-resist-layer system, photolithography, angled evaporation, and dry etching techniques are used to fabricate the electroplating mask. Lines less than 0.2 µm wide, with aspect ratios greater than 5, are obtained with the use of this technique.

Keywords

OPTICAL DEVICE FABRICATION
GOLD
LITHOGRAPHY
RESISTS
OPTICAL FILMS
SUBSTRATES
CURRENT DENSITY
ALUMINUM
SPUTTER ETCHING
RADIO FREQUENCY

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