Meta‐bromobiphenol epoxy resins: Applications in electronic packaging and printed circuit board

5 October 1991

journal article
research article
Published by Wiley in Journal of Applied Polymer Science

Vol. 43 (7) , 1315-1321
https://doi.org/10.1002/app.1991.070430713

Abstract

Novel 2,2′,6,6′‐tetrabromo‐3,3′,5,5′‐tetramethyl‐4,4′‐biphenol (TBTMBP), and its epoxy derivatives, were synthesized to incorporate the stable meta‐brominated phenol moiety into epoxy resin systems. In electronic encapsulation and laminate applications, epoxy systems derived from TBTMBP have exhibited superior hydrolytic and thermal stability as compared with the conventional ortho‐brominated epoxy resins. These properties have resulted in an extended device life for semiconductors and a highT_gwith excellent blister resistance for the printed circuit board, while meeting flame retardancy requirements as well.

Keywords

This publication has 8 references indexed in Scilit:

Performance of Stable Brominated Epoxies in Encapsulants for Microelectronic Devices
Published by American Chemical Society (ACS) ,1989
Chemistry of Stable Brominated Epoxies
Published by American Chemical Society (ACS) ,1989
Effect of High Thermal Stability Mold Material on the Gold-Aluminum Bond Reliability in Epoxy Encapsulated VLSI Devices
8th Reliability Physics Symposium, 1988
The Microstructure of Ball Bond Corrosion Failures
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987
Effect of Bromine in Molding Compounds on Gold - Aluminum Bonds
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
Some structure‐property relationships in polymer flammability: Studies of phenolic‐derived polymers
Journal of Applied Polymer Science, 1982
Thermal decomposition of 4,4′-isopropylidene bis-2,6-dibromophenol (tetrabromobisphenol-A)
Journal of Polymer Science: Polymer Chemistry Edition, 1973
Thermal Degradation and Flame Resistivity of Tetrabrominated Epoxy Resin
Journal of Macromolecular Science: Part A - Chemistry, 1971