Electroless Palladium Plating
- 1 January 1959
- journal article
- research article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 36 (1) , 82-85
- https://doi.org/10.1080/00202967.1959.11869775
Abstract
A process is described for the deposition of palladium by chemical reduction on catalytic surfaces. Most metals are effective catalysts for this reaction. The deposited palladium is also catalytic, so thick coatings can be deposited. This plating solution comprises as essential ingredients a palladium-amine complex, a reducer, and a stabilizing agent. The palladium deposits are ductile, adherent and pure; they are also free from blistering on heating. The electroless feature of the bath permits development of a uniform thickness of deposit on geometrically complex articles.Keywords
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