Stress in copper electrodeposits made with benzotriazole as addition agent
- 1 August 1968
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 13 (8) , 1861-1866
- https://doi.org/10.1016/0013-4686(68)80095-7
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
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