Under Bump Metallization Development for Eutectic Pb-Sn Solders
- 1 January 1998
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Rate of consumption of Cu in soldering accompanied by ripeningApplied Physics Letters, 1995
- Principles of Electronic PackagingJournal of Electronic Packaging, 1989