Silicon Carbide on Insulator Formation by the Smart CUT® Process

• 1 February 1998
• journal article
• Published by Trans Tech Publications, Ltd. in Materials Science Forum
• Vol. 264-268, 765-770
• https://doi.org/10.4028/www.scientific.net/msf.264-268.765

Abstract

Keywords

• INSULATOR STRUCTURES
• SILICON CARBIDE (SIC)
• WAFER BONDING