Constitutive relation and creep-fatigue life model for eutectic tin-lead solder
- 1 June 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (2) , 424-433
- https://doi.org/10.1109/33.56179
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- A creep-rupture model for two-phase eutectic soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Fatigue of Solder Joints in Surface Mount DevicesPublished by ASTM International ,1988
- Elastoplastic Analysis of Surface-Mount Solder JointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Fatigue Life of Leadless Chip Carrier Solder Joints During Power CyclingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Superplastic behavior of PbSn eutectic alloyMaterials Science and Engineering, 1979
- Stress relaxation in Tin-Lead soldersMaterials Science and Engineering, 1979
- Deformation of PbSn eutectic alloys at relatively high strain ratesActa Metallurgica, 1979