Thermal shock resistance of plastic IC package
- 1 January 1990
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 41 (9-10) , 2199-2206
- https://doi.org/10.1002/app.1990.070410924
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Plastic Encapsulation of Semiconductors by Transfer MouldingPublished by Springer Nature ,1985
- EditorialProceedings of the Society for Analytical Chemistry, 1974