Packaging technologies for RFICs: current status and future trends

Publisher Website

20 January 2003

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 7-10
https://doi.org/10.1109/rfic.1999.805228

Abstract

No abstract available

Keywords

This publication has 1 reference indexed in Scilit:

S/390 cost performance considerations for MCM packaging choices
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1998