Effects of Peeling Stresses in Bimaterial Assembly
- 1 December 1991
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 113 (4) , 431-433
- https://doi.org/10.1115/1.2905433
Abstract
Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.Keywords
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