⋅Si≡Si3 defect at thermally grown (111)Si/Si3N4 interfaces

Abstract
Electron-spin resonance on various dehydrogenated (111)Si/(oxy)nitride structures, thermally grown at 1000–1150 °C in NH3, reveals the presence of two defects. The major one, called PbN, is identified as a Si dangling bond (⋅Si≡Si3) at the (111)Si/nitride interface aligned perpendicular to the interface; x-ray photoelectron spectroscopy actually shows that the in situ removal of the native Si oxide prior to nitridation is a prerequisite to obtaining stoichiometric Si3 N4 films. The identification is based on strong similarities with the Pb defect at the (111)Si/SiO2 interface, such as the g matrix, the location at the interface, and linewidth anisotropy. This observation of the ⋅Si≡Si3 defect at a natural Si/solid interface other than the Si/SiO2 one confirms Pb as a prototype dangling-bond center, its salient properties being set by the underside Si matrix—not by the overlaying insulator. Yet, secondary ESR signatures do differ as the large interface strain, resulting from the greater rigidity of the (oxy)nitrides as compared to SiO2 films, causes a slight perturbation of the Pb(N) symmetry, thereby lifting its C3v symmetry. This is born out at 4.3 K by specific distortions of the PbN line shape. Upon increasing temperature, the perturbation of the defect’s symmetry is smoothed due to thermally activated averaging over the various defect distortions. The properties of the Pb and PbN defects at higher temperatures become largely identical. Comparison of the extracted unresolved N14 PbN and O17 Pb hf broadenings shows that their relative strengths comply with the known isotopic properties.