Study of the enhanced oxidative degradation of polymer films at polymer/copper (oxide) interfaces using depth profile and inert marker techniques

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Abstract
The degradation of poly(ester imide) films on metal substrates was monitored by determining the changes in polymer film thickness using x-ray photoelectron spectroscopy combined with ion sputter depth profiling. Thin films (1000–7000 Å) of poly(ester imide) wire enamel were spin coated onto metal substrates and aged in air at 200 °C for several hours. For films on copper substrates, thermal oxidative degradation of the polymer led to thinning of the film (2.5–3 Å/min), whereas films on aluminum substrates did not exhibit a decrease in thickness. The catalytic effect of copper upon the degradation of the polymer occurs primarily at the copper (oxide)/polymer interface, as revealed by the location of an inert gold marker layer within the polymer film before and after aging.

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