Anisotropic Conducting Adhesives for Electronic Interconnection
- 1 February 1993
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 5 (2) , 4-8
- https://doi.org/10.1108/eb037820
Abstract
This paper presents analytical and computational models of adhesive joints constructed from anisotropic conducting materials. Such materials are becoming increasingly important in the construction of fine pitch interconnection, for example the assembly of surface mounted components to printed circuit boards, and are likely to find considerable application in silicon die attach as alternatives to current ‘flip chip’ technologies. The paper presents design models of the mechanical and low frequency electrical behaviour of typical materials and relates these models to manufacturing process parameters.Keywords
This publication has 3 references indexed in Scilit:
- A review of the impact of conductive adhesive technology on interconnectionJournal of Electronics Manufacturing, 1992
- The Elastic and Thermo-elastic Properties of Composite MediaProceedings of the Physical Society. Section B, 1956
- The Electrical Conductivity of Composite MediaProceedings of the Physical Society. Section B, 1956