Response of 60Sn-40Pb Under Thermal and Mechanical Cycling
- 1 January 2000
- book chapter
- Published by ASTM International
- p. 85-102
- https://doi.org/10.1520/stp15255s
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin AlloyJournal of Electronic Packaging, 1999
- Some aspects of thermomechanical fatigue of AISI 304L stainless steel: Part I. creep- fatigue damageMetallurgical and Materials Transactions A, 1994
- ASPECTS OF HIGH‐TEMPERATURE LOW‐CYCLE THERMOMECHANICAL FATIGUE OF A SINGLE CRYSTAL NICKEL‐BASE SUPERALLOYFatigue & Fracture of Engineering Materials & Structures, 1993
- Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount ComponentsPublished by Springer Nature ,1993
- Isothermal Fatigue of 63Sn-37Pb SolderJournal of Electronic Packaging, 1990
- Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder JointsJournal of Electronic Packaging, 1989
- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988
- MACROSCOPIC DESCRIPTION OF THE MICROSTRUCTURAL CHANGES INDUCED BY VARYING TEMPERATURE: EXAMPLE OF IN100 CYCLIC BEHAVIOURPublished by Elsevier ,1980
- The plastic deformation of non-cubic metals by heating and coolingProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1946