Packaging of high density fiber/laser modules using passive alignment techniques
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6) , 944-955
- https://doi.org/10.1109/33.206916
Abstract
No abstract availableThis publication has 23 references indexed in Scilit:
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