Microscale lithography via channel stamping: Relationships between capillarity, channel filling, and debonding
- 1 March 1999
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 74 (9) , 1332-1334
- https://doi.org/10.1063/1.123541
Abstract
A polymer or metallo-organic precursor solution may be transferred from the channels of a stamp to a substrate producing a micron or submicron scale pattern. The stamped polymer pattern is used as a mask for device fabrication. The stamped metallo-organic precursor solution is heat treated to produce a metal or ceramic pattern directly. Here we report conditions that optimize the filling of channels, the debonding of the solution from the channels during evaporation, and the transfer of the pattern to a substrate. We show that poor wetting can optimize these conditions.Keywords
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