Über die Temperaturabhängigkeit der Dichte von dünnen Kupferaufdampfschichten / On the Temperature Dependence of the Density of thin Vacuum Deposited Copper Films

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Abstract
A short literature survey on the subject is given with special emphasis on discrepancies and contradictional interpretations of results. Our own experiments on thin copper films evaporated onto glass substrates at different condensation temperatures are reported. Density values were calculated from the film thickness, which was measured by Kiessig's method and from the deposited mass determined by atomic absorption spectrometry as well as gravimetric measurements. The density defect decreases with increasing film thickness, as already established, and also with temperature. From these results together with those obtained from films which were deposited during a rapid temperature rise from the low substrate temperature to room temperature we conclude that the density defect is localized at the substrate - film boundary.

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