Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation
- 1 December 1997
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 9 (2) , 22-28
- https://doi.org/10.1108/09540919710800647
Abstract
A series of composite solders in 63/37 Sn/Pb was prepared: Cu6 Sn5 (10, 20, 30 wt%); Cu3 Sn (10, 20, 30 wt%); Cu (7.6 wt%); Ag (4 wt%); and Ni (4 wt%). These composite solders were prepared by two procedures: (A) admixture with solder paste; and (B) admixture with molten solder. The original particulates and the final composite solders were analysed and characterised by SEM (scanning electron microscopy) EDX (energy dispersive X‐ray), and ESCA (electron spectroscopy for chemicals analysis); or XPS (X‐ray photoelectron spectroscopy). A variety of morphological characterisations, intermetallics and porosities were noted. Good wetting was noted in all cases, and porosity was greater for method (A). The particulates all exhibited excellent binding to the solder matrix.Keywords
This publication has 6 references indexed in Scilit:
- Composite soldersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A Semi-Empirical Methold to Characterize Effective Elastic Moduli of Components in Binary Composite MaterialsJournal of Composite Materials, 1991
- Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and ReliabilityPublished by Springer Nature ,1991
- ESCA Analysis of Ageing of Metallic Surfaces: Solderability of Nickel SilverSoldering & Surface Mount Technology, 1991
- Composite soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- On the Fracture Behaviour of Metal-to-Ceramic JointsPublished by Springer Nature ,1986