Theory for the etching of organic materials by ultraviolet laser pulses
- 31 July 1989
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 55 (5) , 421-423
- https://doi.org/10.1063/1.101884
Abstract
A theoretical description of the ultraviolet laser etching process is developed. The threshold for laser ablation is reached when the density of absorbed photons is approximately equal to the density of chromophores in the material. Saturation of the absorption coefficient, absorption by the plume of ablated products, and multiphoton effects are considered. Agreement with all available experimental etch data, including femtosecond ultraviolet laser ablation, is found. The description is based on an analysis of the radiation transport at high intensities and is independent of the question as to whether ultraviolet laser ablation is photochemical or thermal.Keywords
This publication has 15 references indexed in Scilit:
- Theory of polymer ablationApplied Physics Letters, 1988
- Femtosecond uv excimer laser ablationApplied Physics B Laser and Optics, 1987
- Ultraviolet laser ablation of polyimide filmsJournal of Applied Physics, 1987
- Dynamics of UV laser ablation of organic polymer surfacesJournal of Applied Physics, 1986
- Ablation of Polymers and Biological Tissue by Ultraviolet LasersScience, 1986
- Photochemical cleavage of a polymeric solid: details of the ultraviolet laser ablation of poly(methyl methacrylate) at 193 nm and 248 nmMacromolecules, 1986
- Dependence of photoetching rates of polymers at 193 nm on optical absorption depthApplied Physics Letters, 1986
- Excimer laser etching of polyimideJournal of Applied Physics, 1985
- Calorimetric and acoustic study of ultraviolet laser ablation of polymersApplied Physics Letters, 1985
- Direct etching of polymeric materials using a XeCl laserApplied Physics Letters, 1983