Characterisation of electromigration damage by multiple electrical measurements
- 1 September 1993
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 33 (11-12) , 1829-1840
- https://doi.org/10.1016/0026-2714(93)90088-g
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Detection of hot spots in thin metal films via thermal noise measurementsIEEE Electron Device Letters, 1989
- Reliability Evaluation of Thick Film Resistors Through Measurementof Third Harmonic IndexActive and Passive Electronic Components, 1981