Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films
- 1 November 1993
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 11 (6) , 2970-2974
- https://doi.org/10.1116/1.578677
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: