Ceramic Materials for Electronic Packaging
- 1 September 1989
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 111 (3) , 183-191
- https://doi.org/10.1115/1.3226532
Abstract
The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.Keywords
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