Selective metallization of silica surfaces by copper CVD using a chemical affinity pattern created by gas phase silylation and UV exposure
- 31 January 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 33 (1-4) , 15-23
- https://doi.org/10.1016/s0167-9317(96)00026-3
Abstract
No abstract availableKeywords
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