Hillock Growth and Stress Relief in Sputtered Au Films
- 1 January 1969
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 40 (1) , 394-400
- https://doi.org/10.1063/1.1657067
Abstract
Growth of hillocks has been observed during annealing of sputtered Au films. The height of a hillock is proportional to the area it occupies in the film. This empirical relationship has been used in a model which postulates that hillock growth is associated with stress relief in the Au. The model is able to relate the sign and magnitude of the stress with hillock size and density. The general character of the growth kinetics is also predicted by the model.This publication has 1 reference indexed in Scilit:
- Dielectric Thin Films through rf SputteringJournal of Applied Physics, 1966