Method for measuring diffusion of moisture in polyimide

Abstract
A method of easily measuring the diffusion coefficient for the diffusion of moisture in polyimide is proposed. A polyimide film which is sandwiched between a silicon wafer and a metal film is exposed at the edge to moisture for various lengths of time. The progression of the diffusion process is delineated by placing the sample on a hot plate at about 350 °C. The pressure of the moisture causes the metal film to bubble. Diffusion coefficients are calculated for two different forms of polyimide.

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