Effects of stoichiometric mixing ratio on epoxy cure—a dielectric analysis

Publisher Website

1 March 1986

journal article
Published by Wiley in Polymer Engineering & Science

Vol. 26 (5) , 362-366
https://doi.org/10.1002/pen.760260507

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

In-situMeasurement of the Properties of Curing Systems with Microdielectrometry
The Journal of Adhesion, 1982
Kinetics of cure of epoxy resin system bisphenol-A diglycidylether-di(4-aminophenyl)sulphone
Polymer, 1980