New metallurgical systems for electronic soldering applications
- 1 April 1999
- journal article
- conference paper
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 74 (1-3) , 70-76
- https://doi.org/10.1016/s0924-4247(98)00305-7
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Advances in Bonding Technology for Electronic PackagingJournal of Electronic Packaging, 1993
- Principles of Electronic PackagingJournal of Electronic Packaging, 1989