Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 460-466
- https://doi.org/10.1109/tchmt.1983.1136213
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Modular SCR Assemblies in VSCF SystemsJournal of Energy, 1982
- The development of a power darlington transistor and hybrid integrated circuit for a DC to DC converterPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1979
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925