New Photosensitive High Temperature Polymers for Electronic Applications

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Abstract
A new photosensitive high temperature polymer stable up to 500%deg;C with high photosensitivity and high resolution has been developed. The trend toward a high degree of integration in solid-state technology requires the use of new high temperature photosensitive insulating materials. Toray's Photoneece system provides such versatile polyimide pattern-generation techniques, containing a unique photosensitive polyimide precursor which can be spun or coated on the substrate. The resultant relief of photosensitive polyimide precursor, after exposure to UV light with a mask, development, and cure processing, is transformed into a cyclized aromatic polyimide. The new system has higher photosensitivity and resolution and eliminates three steps in the conventional pattern-making process for integrated circuits, resulting in a significant cost reduction. The characterization of pattern generation, the conversion to polyimide patterns, and the properties of both Photoneece and the patterns are discussed.

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