Abstract
An n-p-n-type bipolar transistor with an emitter region formed by a new ion implantation predeposition diffusion exhibits much less leakage current compared to that formed by a conventional process. This new emitter region has a thermal history of first anneal at 500°C, second anneal at 900°C, and third anneal at 1050°C after phosphorus implantation predeposition of 1 × 1016/cm2at 50 keV.

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