Interface contribution to the capacitance of thin-film Al-Al2O3-Al trilayer structures
- 26 October 1987
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 51 (17) , 1349-1351
- https://doi.org/10.1063/1.98675
Abstract
A dual‐gun reactive ion beam sputtering technique has been used to reproducibly fabricate Al2O3 dielectrics with low electrical loss for controlled thickness ranging from approximately 10 to 360 Å. The linear dependence of the reciprocal capacitance on dielectric thickness of Al‐Al2O3‐Al trilayer structures incorporating this dielectric reveals a significant contribution from an interfacial capacitance in series with the geometric capacitance. Room‐temperature measurements of both the dc resistance and the frequency‐dependent complex impedance demonstrate that, with respect to bulk, there is an enhanced frequency‐dependent dielectric loss associated with this interfacial capacitance.Keywords
This publication has 12 references indexed in Scilit:
- RF sputter-deposited aluminum-oxide films as high quality artificial tunnel barriersIEEE Transactions on Magnetics, 1987
- Summary Abstract: Ion-assisted deposition of Ta2O5 and Al2O3 thin filmsJournal of Vacuum Science & Technology A, 1986
- Ion-based methods for optical thin film depositionJournal of Materials Science, 1986
- On electric surface impedanceZeitschrift für Physik B Condensed Matter, 1978
- 2.7 Deposition methods for dielectric films and their electrical propertiesVacuum, 1977
- Metallic-Field Effect and Its Consequences in Field Emission, Field Ionization, and the Capacitance of a CapacitorPhysical Review B, 1972
- Conduction in thin dielectric filmsJournal of Physics D: Applied Physics, 1971
- Dielectric properties of thin films of aluminium oxide and silicon oxideThin Solid Films, 1968
- Current Flow in Very Thin Films of Al2O3 and BeOJournal of Applied Physics, 1963
- Anomalous Capacitance of Thin Dielectric StructuresPhysical Review Letters, 1961