Prediction and measurement of thermal conductivity of diamond filled adhesives
- 2 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 219-224
- https://doi.org/10.1109/ectc.1992.204210
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- The synthesis, properties and applications of diamond ceramic materialsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal conductivity of particulate‐filled polymersJournal of Applied Polymer Science, 1973
- Two types of diamondPhilosophical Transactions of the Royal Society A, 1933